Theory & Tech. of Solid State Devices (I)
- Active MOS and Bipolar Process Integration and Parasitic effects in them, Frequency and Process considerations in Design of active components, Latch-up effect in CMOS Integrated Circuits
- Lithography, Types of Lithography: Optical, Electron, Ion and Xiray Lithographies and their applications, Lithography Sources, Mask Generation Methods, Optical Exposure Systems, Diffraction Effects, Photoresist compouds,
- Passive Components and their Parasitic Effects, Parasitic Effects in MOS and Junction Capacitors, Spiral Inductors, IC Packaging, Thin layer resistors,, Lawrence-Warner Curves, Parasitic effects in Design of Diffusion, Epitaxial, and Pinch Resistors, D.C. and Small Signal Parasitic effects Modeling
- Silicon and Allium Arsenide Semiconductors Crystals Growths, Czochralski and floating zone growth methods, Doping adding, Crystals defects , Basic and fundamental Processes in Integrated Circuits Fabrication Technology
- Oxidation And Nitridation, Methods of Oxidations, Oxidation System Types, Second order effects in Oxidation, Nitridation properties
- Ion Implantations , Technology and L.S.S. Mathematical Modeling of Ion Implantation, Junction Depth Estimation
- Etching, Dry and Wet etchings,Film Deposition Types: Evaporation, Chemical Vapour Deposition(C.V.D.), Sputtering, MOCVD, MBE, LPE,Oxide and Nitride films, Metals and Dielectric films Deposition technics
- Diffusion Related Process of Doping in Si-wafers, First order Diffusion Theory, Ficks Law, Predeposition and Drive-in Diffusion process steps, Junctions estimation for fabrication of Base, Emitter and Collector regions in Bipolar Transistors....,Sheet Resistance methods of Measuring, Irvin curves, Epitaxial growth method
- CMOS & BICMOS circuitry: Static & Dynamic behaviors